UCLIC Research Seminar Series

UCLIC Research Seminar 6th July: Yoshifumi Kitamura,  Potential of Nonverbal Information to Enrich Interpersonal Telecommunication
Yoshifumi Kitamura, Tohoku University

Title

UCLIC Research Seminar 6th July: Yoshifumi Kitamura, Potential of Nonverbal Information to Enrich Interpersonal Telecommunication

Abstract

Please Note the time & location. This seminar will begin at 3.30pm

In future online communication, everyone should be able to communicate equally and with humanity. We hope that it will be an important tool to support an accessible and inclusive society that is accommodating to diversity in terms of disabilities, culture, gender, and so on.
One of the keys to humanistic communication is the exchange of a wide range of non-verbal information. In this talk, I will introduce our group's ongoing efforts toward the transmission of non-verbal information for the realization of future online communication systems.

Biography

He has been a Professor and a Deputy Director at Research Institute of Electrical Communication, Tohoku University. His research interests include interactive content design, human computer interactions, 3D user interfaces, virtual reality, and related fields. Prior to arriving at Tohoku, he was an Associate Professor at Osaka University, and a researcher at ATR Communication Systems Research Laboratories. His first formal appointment was in the Information Systems Research Center, Canon Inc.
He has served in various roles in international conferences such as IEEE VR, 3DUI, JVRC, ICAT, EGVE, EuroVR, ACE, ACM VRST, ITS/ISS, SIGGRAPH Asia, and CHI, including SIGGRAPH Asia 2015 Conference Chair, CHI 2021 General Chair, etc. He has also served on the Steering Committee for VRST, 3DUI, SIGGRAPH Asia, ICAT, EGVE, CHI, etc., and has been the VRST Steering Committee Chair. In international academic organizations, he has served as Japan Liaison for IFIP TC-13, Chair of ACM SIGCHI Asian Development Committee (2015-2021), and Chair of Japan ACM SIGCHI Chapter (2016-2022).